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在商用 PERC、TOPCon 與背接觸矽太陽能電池的金屬化過程中，採用銀鍍銅（Ag-coated Cu）漿料常受到高溫燒結需求的限制，因為高溫會促進銅的氧化。此氧化現象會增加串聯電阻與接觸電阻，導致填充因子（FF）下降；同時，銅擴散進入矽基板也可能降低開路電壓（VOC）。本研究探討將銀鍍銅漿料應用於 n 型 TOPCon 太陽能電池後電極的可行性。我們的結果顯示，在受控的雷射開窗、低溫固化與雷射輔助燒結製程下，銀鍍銅漿料能達到極低的接觸電阻率，並維持 VOC。最終獲得填充因子 81.43%、接觸電阻率 2.32 mΩ·cm²，以及電池效率 24.24%。值得注意的是，後電極採用銀鍍銅漿料可相較於傳統銀漿減少 40–60% 的銀用量，同時維持相當的電池性能。

The incorporation of Ag-coated copper (Cu) paste in the metallization of commercial PERC, TOPCon, and back-contact silicon solar cells is often hindered by high-temperature firing requirements that promote copper oxidation. Such oxidation can increase series and contact resistances, reducing the fill factor (FF), while copper diffusion into the silicon substrate can degrade the open-circuit voltage (VOC). In this study, we explore the use of Ag-coated Cu paste as the rear electrode material in n-type TOPCon solar cells. Our results indicate that, under a controlled laser contact opening, low-temperature curing, and laser-assisted firing process, the Ag-coated Cu paste achieves minimal contact resistivity and maintains VOC. A fill factor of 81.43%, a contact resistivity of 2.32 mΩ·cm², and a cell efficiency of 24.24% were attained. Notably, incorporating Ag-coated Cu paste on the rear electrodes reduces silver consumption by 40–60% relative to conventional silver pastes, while retaining comparable cell performance.